Taiwan Semiconductor’s ThinDPAK Schottkys Deliver Power Density Upgrades
AEC-Q Schottky rectifiers in lighter “thin” package with same footprint as standard DPAKs offer drop-in improvements in power density and thermal performance
The planar Schottky topology of advanced ThinDPAK devices provides industry-leading rectification efficiency that dissipates less heat than alternatives. For the heat that is dissipated, the new ThinDPAK devices’ thermal resistance (Rj∅A) is 21.9% lower. Moreover, the devices save both weight and headroom compared to standard DPAKs.
“Our new ThinDPAKs are an excellent choice for optimizing new designs – and also for upgrading the performance of existing designs,” said Sam Wang, vice president, TSC Products. “Although ThinDPAKs are thinner, their footprint is identical to standard DPAKs, allowing simple drop-in replacement and easy trial.”
The ThinDPAK series comprises a selection of 34 devices with reverse voltage (VVRRM) ratings from 45Vdc to 200Vdc with current ratings up to 150A. Devices are available in single and dual (common cathode) configurations.
Design resources include comprehensive datasheets and spice models for each component in the series.
Price (Production Quantities): From $0.31 (depending on device and quantity)
Lead Time: Samples: In-stock
Production Quantities: 12 weeks (ARO
Kevin Parmenter
Taiwan Semiconductor
+1 415-271-0425
kevin.parmenter@tscus.com
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Taiwan Semi ThinDPAK Comparison with Standard DPAKs
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