Today at Supercomputing 2024 (SC24), Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and accelerated computing, announced that it successfully raised $115 million in new funding as part of an oversubscribed Series C equity financing round led by Spark Capital. New investors joining the round include Arm, Cisco Investments, Maverick Silicon, Samsung Catalyst Fund, and VentureTech Alliance, with support from existing investors. Concurrently, Enfabrica also announced availability in Q1 2025 of its groundbreaking 3.2 Terabit/sec (Tbps) Accelerated Compute Fabric (ACF) SuperNIC chip and pilot systems. Together, Enfabrica’s funding and product news solidify its position in the high-growth AI infrastructure industry and highlight its leadership role in the future of GPU compute networks.

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Enfabrica's Accelerated Compute Fabric SuperNIC Chip (Photo: Business Wire)

“This Series C fundraise fuels the next stage of growth for Enfabrica as a leading AI networking chip and software provider,” said Rochan Sankar, CEO of Enfabrica. “We were the first to draw up the concept of a high-bandwidth network interface controller fabric optimized for accelerated computing clusters. And we are grateful to the incredible syndicate of investors who are supporting our journey. Their participation in this round speaks to the commercial viability and value of our ACF SuperNIC silicon. We will advance the state of the art in networking for the age of GenAI.”

Enfabrica Series C Funding Highlights:

• The oversubscribed $115 million Series C financing round was led by Spark Capital, joined by new investors Arm, Cisco Investments, Maverick Silicon, Samsung Catalyst Fund, and VentureTech Alliance.
• Supporting capital for the round was provided by existing investors including Atreides Management, Alumni Ventures, IAG Capital, Liberty Global Ventures, Sutter Hill Ventures, and Valor Equity Partners.
• The Company will deploy the new funding to drive the volume production ramp of ACF SuperNIC chips, further scale its global R&D team, and expand its next-generation product line development.

Enfabrica’s ACF SuperNIC:

The AI SuperNIC has emerged as a high-growth silicon product category to logically interconnect GPUs and accelerators across a high-performance scale-out network in an AI data center. Enfabrica’s ACF solution delivers multi-port 800-Gigabit-Ethernet connectivity to GPU servers, and four times the bandwidth and multipath resiliency of any other GPU-attached network interface controller (NIC) product in the industry. Enfabrica is the first in the industry to build a grounds-up SuperNIC chip delivering the highest performance, resiliency, and efficiency of data movement demanded by large-scale training, inference, and retrieval-augmented generation (RAG) workloads associated with frontier AI models. For more details on the launch and availability of Enfabrica’s ACF SuperNIC, see the company’s additional press release.

ACF SuperNIC silicon will be available in initial quantities in calendar Q1 of 2025. Both ACF SuperNIC chips and pilot systems are now commercially orderable from Enfabrica and select partners. For more information on Enfabrica’s ACF SuperNIC silicon, system and software, please visit enfabrica.net.

About Enfabrica:

Enfabrica is a cutting-edge silicon and software company building disruptive networking solutions for parallel, heterogeneous, and accelerated computing infrastructure. As the inventors of the Accelerated Compute Fabric SuperNIC (ACF-S), Enfabrica’s groundbreaking chips, software stack design, and partner-enabled systems give customers the freedom to stitch the fabric of our AI-enabled future and scale GPU and accelerated compute clusters like no one has. Enfabrica is elevating networking for the age of GenAI by producing the world’s most advanced, performant and efficient solutions that interconnect compute, memory and network. To learn more, follow us on LinkedIn or visit enfabrica.net.

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